Speakers
& Topics at FCC 2008 |
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Bal Seal Engineering Inc
www.balseal.com
Canted-Coil Spring Connectors
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Mr. Brad Brown
President
ATL Technology
China Current Trends and What the Future Holds
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Dr. Diganta Das
Technical Editor
CALCE (Center for Advanced Life Cycle Engineering) , UMD
Counterfeit Electronics: A Peek into the Future
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Mr. Donald M. Dodge
Vice President of Research
Calmont Wire and Cable, Inc.
Updated COTS Cable Information
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Mr. Ken Fleck
Fleck Research
How 2008 Evolved - Driving Forces - Outlook for 2009
(revised 10/23/2008)
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Mr. Claus Guglhoer
VP Worldwide Sales
EPT
Press-Fit Connectors in Automotive Applications
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Mr. Ed Hallahan & Ms. Kelli Sisler
Technology Market Manager & Technical Marketing Manager
Ticona
High-Performance V-0 Solutions for Greener Electronics
Engineering Polymers for E/E and Consumer Electronics
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Mr. Steve Harston
Graduate Student, BYU
ATL Technology
Recent Developments in the Design of Constant-Force Electrical
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Mr. Yun Ling
Principal Engineer
Intel
SuperSpeed USB Bus Interconnect Overview
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Mr. Louis Lipomi
VP of Americas - Global Distribution
FCI
The Role and Impact of Distribution on the Global Connector Market
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Mr. Louis Miscioscia
Managing Director
Cowen & Company
The Economy and the Impact on the Electronics Industry
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Mr. Gregory Powers
Market Development Manager, Global Aerospace, Defense & Marine
Tyco Electronics
Mil/Aero Trends in Backplane Interconnect:
Design Attributes with VPX as a Case Study
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Mr. John Powers
President
IntraOP Medical Corp.
Medical Industry and Technology Trends | |
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Mr. Vadim Radunsky
President
Hypertronics
The Connector Market in Russia
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Mr. Mark Rodda
Principal Engineer, Global SCT Interconnect Technology Lead
Motorola
Handset Interconnect Trends and How to Get There --
A Guide to Global Component Development
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Dr. Bidyut Sen
Director, Semiconductor Packaging and PCB Technology
Sun Microsystems
Trends in SPARC Microprocessor Packaging
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Mr. Tony Stelliga
CEO
Quellan
From Data Center to Living Room: Active Interconnects are Here | |
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