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Workshop Topics
for FCC 2009
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 | FLECK RESEARCH
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| Global Connector Research Group |
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November 5 & 6, 2009 at the Laguna Cliffs Resort & Spa in Dana Point, California
Topics subject to change without notice. Workshop handouts may not include all of the information that may
be displayed or discussed during the session.
| Workshop 1:
Electronic Technology Trends Impacting Interconnect Industry
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– Leading product designs and driving forces for each demand sector
– Computer: $8.1 billion (desktops, notebooks, mainframe, storage, etc)
– Telecom: $4.1 billion (central office, switching, transmission, DWDM, SONET, ISDN, ATM, etc)
– Wireless: $4.3 billion (handsets, base stations, data networks, mobile radio, CATV, etc)
– Datacom: $4.7 billion (LAN, WAN, WLAN, PAN, Ethernet, Hubs, Routers, etc)
– Mil/Aero: $4.4 billion (F-35, F-22, F/A-18, helicopters, UAV's, missiles, ships, etc)
– Auto/Off-Road: $8.4 billion (cars, vans, SUV's, trucks, electronics, etc)
– Instruments: $2.3 billion (test & measurement, test systems, laboratory, etc)
– Consumer Electronics: $3.1 billion (TV, DVD, DVR, audio, MP3, digital cameras, mobile, etc)
– Industrial/Harsh Environment: $6.2 billion (process controls, IC
processing/assembly, geophysical, petroleum, railroad, ships, etc)
– Commercial Aircraft, Satellite, & Space: $1.9 billion (narrow
body, wide body, business, regional, helicopter, cargo, avionics,
satellites, launch vehicles, etc)
– Medical: $7.8 billion (O2 Sat, ultrasound, monitors, MRI, CAT, etc) |
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| Workshop 2: Analysis of Market Performance and Connector Designs |
– $700 billion asset relief program (impact of financial crisis on Wall Street, investment banks, credit market)
– Impact upon connector industry
– Soft 4Q and soft 2009 certain
– Worst case 4Q and worst case 2009 which could happen
– Analysis of connector categories including printed circuit, circular, I/O, IC socket, auto, fiber optic, etc
– 150 leading industry product designs: PCI-E, VHDM, medical push-pull, HDMI, FAKRA, LGA, 0.8mm, 2.8mm blade, LC, etc
– Leading suppliers in each connector category
– High bandwidth/high speed connectors
– Analysis of fiber, RF coax, high bandwidth, and I/O cable assemblies
– Backpanel and interconnect devices |
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