|
Workshop Topics
for FCC 2007
|
 | FLECK RESEARCH
|
| Global Connector Research Group |
|
October 4 & 5, 2007 at the Bellagio in Las Vegas, Nevada
Topics subject to change without notice. Workshop handouts may not include all of the information that may
be displayed or discussed during the session.
| Workshop 1:
Electronic Technology Trends Impacting Interconnect Industry
|
– Wireless: GSM, CDMA,
2.5 / 3.0 G, smart phones, camera phones
–
Telecom: DWDM, ISDN, Sonet, WIMAX, Wi-Fi, DSL, VoIP
– Network: RJ Cat 5, 5e, 6, 6e, 7, RJ-Mag, high-bandwidth
– Mil / Aero: F-35, F-22, F-18, AH-64, DDG 82, LPB
22, SSN 774, M1
– Satellites: SPIRS, INTELSAT, Milstar, MUOS
– Computer: USB, 1394, PCI Express, SAS, SATA, BGA,
LGA
– Auto: ECU, engine, instruments/cockpit, telematics,
by-wire technology
– Consumer: MP3, DVD, digital cameras, games, digital
TV, digital video recorders (DVR/PVR)
– Medical: Defibrillators, lasers, MRI, implanted
devices, surgical systems, diagnostic systems |
|
| Workshop 2:
Market Performance |
– 32 countries of the
world (U.S., Germany, France, Japan, China, etc.)
– End use (computer, telecom, wireless, network,
auto, mil / aero)
– Leading suppliers by product:
Printed Circuit, I/O, RF coax, circular, automotive, fiber
optic
– Leading suppliers by end use: Mil /
aero, consumer, medical, telecom
– Top product
designs: Post / box, VHDM, serial interface, LGA, SMA,
SC, flex circuit
– Top EDMs and ODMs: Factory
locations, purchases of interconnects
– Major business and market issues impacting the
industry
– Manufacturing processes: stamp and form, injection
molding, reel-to-reel, dies and tooling |
|
|
|
